JPH0497360U - - Google Patents

Info

Publication number
JPH0497360U
JPH0497360U JP130691U JP130691U JPH0497360U JP H0497360 U JPH0497360 U JP H0497360U JP 130691 U JP130691 U JP 130691U JP 130691 U JP130691 U JP 130691U JP H0497360 U JPH0497360 U JP H0497360U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP130691U
Other languages
Japanese (ja)
Other versions
JP2576383Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1991001306U priority Critical patent/JP2576383Y2/ja
Publication of JPH0497360U publication Critical patent/JPH0497360U/ja
Application granted granted Critical
Publication of JP2576383Y2 publication Critical patent/JP2576383Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
JP1991001306U 1991-01-21 1991-01-21 光半導体装置 Expired - Lifetime JP2576383Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1991001306U JP2576383Y2 (ja) 1991-01-21 1991-01-21 光半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1991001306U JP2576383Y2 (ja) 1991-01-21 1991-01-21 光半導体装置

Publications (2)

Publication Number Publication Date
JPH0497360U true JPH0497360U (en]) 1992-08-24
JP2576383Y2 JP2576383Y2 (ja) 1998-07-09

Family

ID=31728572

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1991001306U Expired - Lifetime JP2576383Y2 (ja) 1991-01-21 1991-01-21 光半導体装置

Country Status (1)

Country Link
JP (1) JP2576383Y2 (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007035758A (ja) * 2005-07-25 2007-02-08 Rohm Co Ltd 受光ジュール

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100511633B1 (ko) * 2002-10-28 2005-09-02 전홍수 전신주용 까치퇴치장치

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5980979A (ja) * 1982-10-29 1984-05-10 Matsushita Electric Ind Co Ltd 光電変換装置
JPH02133038U (en]) * 1989-04-12 1990-11-05

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5980979A (ja) * 1982-10-29 1984-05-10 Matsushita Electric Ind Co Ltd 光電変換装置
JPH02133038U (en]) * 1989-04-12 1990-11-05

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007035758A (ja) * 2005-07-25 2007-02-08 Rohm Co Ltd 受光ジュール

Also Published As

Publication number Publication date
JP2576383Y2 (ja) 1998-07-09

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term